Ingrid De Wolf mail Show e-mail Structural Composites and Alloys, Integrity and Nondestructive Testing (SCALINT), Leuven (Arenberg) Kasteelpark Arenberg 44 - box 2450 3001 Leuven KU Leuven map phone Show phone numbers Unit Structural Composites and Alloys, Integrity and Nondestructive Testing (SCALINT), Leuven (Arenberg) Ingrid De Wolf. imec AND KU Leuven. Verified email at imec.be. Articles Cited by Public access. Title. Sort. Sort by citations Sort by year Sort by title. Cited by. Cited by.. X Rottenberg, I De Wolf, BKJC Nauwelaers, W De Raedt, HAC Tilmans. Journal of Microelectromechanical Systems 16 (5), 1243-1253, 2007. 165:
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Ingrid De Wolf In this paper, we demonstrate three approaches to enhance the topographical contrast of infrared images obtained from lockin thermography (LIT). Infrared imaging, particularly LIT,. Ingrid De Wolf [.] Anqi Qiu; The elastic modulus of a variety of porous low dielectric constant thin films with porosities in the range of 24-47% and thicknesses between 148 and 235 nm is. Ingrid De Wolf Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018 2018. Ingrid DE WOLF | Scientific Director | imec, Leuven | 3D System Integration Program | Research profile - Page 3 Home imec 3D System Integration Program Ingrid De Wolf Ingrid De Wolf imec · 3D.
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Publications. 1 - 10 of 289. Nondestructive monitoring of die warpage in encapsulated chip packages. Authors: Ingrid De Wolf. Pages: 653 - 662. Fine Pitch 3D-Integration Using Self-Aligned Assembly. Authors: Vikas Dubey, Ingrid De Wolf, Jean-Pierre Celis. Investigation of the Impact of Externally Applied Out-of-Plane Stress on Ferroelectric FET. Ingrid De Wolf Chris Van Hoof Zero-level packaging, i.e. the encapsulation of the MEMS device at wafer level, is an essential technique for MEMS miniaturization and cost reduction. Biography Eric Beyne (Senior Member, IEEE) received the master's degree in electrical engineering and the Ph.D. degree in applied sciences from Katholieke Universiteit Leuven (KU Leuven), Leuven, Belgium, in 1983 and 1990, respectively. Search within Ingrid de Wolf's work. Search Search. Home; Ingrid de Wolf; Ingrid de Wolf. Skip slideshow. Most frequent co-Author. Most cited colleague. Top subject. Physical sciences and engineering. View research. Top keyword. 3D imaging. View research. Most frequent Affiliation. Bibliometrics. Average Citation per Article. 0.
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Simon Van Beek, De Wolf Add to Mendeley https://doi.org/10.1016/j.sse.2022.108298 Get rights and content Abstract A multi-energy level agnostic model is used to examine defect generation during time-dependent dielectric breakdown stress. Ingrid De Wolf We measured the effects of oxytocin (0.1 U/ml) on the current (I sc) recorded through skins ofRana temporaria incubated with an isotonic K+ solution on the api al side while the.
Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei: Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. 79: 297-305 (2017) Affiliations: [Dept. Materials Engineering, KU Leuven, Leuven, Belgium].
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Ingrid De Wolf 1. Published under licence by IOP Publishing Ltd Semiconductor Science and Technology, Volume 11, Number 2 Citation Ingrid De Wolf 1996 Semicond. Sci. Technol. 11 139 DOI 10.1088/0268-1242/11/2/001. Download Article PDF. Figures. Skip to each figure in the article. Tables. Ingrid De Wolf, Ingrid De Wolf. imec, Leuven, 3001 Belgium. Department of Materials Science, KU Leuven, Leuven, 3001 Belgium. Search for more papers by this author. Gyu-Tae Kim, Corresponding Author. Gyu-Tae Kim.
[email protected]; School of Electrical Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841 Republic of Korea.
