Laser Direct Imaging and its advantages Sierra Circuits

Laser Direct Imaging is the next step in the evolution of the PCB photolithography process. Unlike photo exposure, LDI does not employ a phototool. It directly exposes a digitally saved pattern onto the resist. Photoresist is selectively exposed to the laser beam in increments across the substrate in a rastering manner. In response to new electronics tendencies, the PCB manufacturing industry has come up with a new imaging technique known as Laser Direct Imaging. Below you will find an introductory guide to this process. What exactly is LDI? When a circuit board is made, the imaging process is what defines the circuit traces.

Laser Direct Imaging and its advantages Sierra Circuits

Laser Direct Imaging (LDI) is a cornerstone of high precision PCB fabrication. Adoption is on-going so it costs more than traditional fabrication. Nobody wants to overspend on their Printed Circuit Board. One way to overspend is to find yourself scrapping boards because their construction didn't meet the stated performance objectives. Laser Direct Imaging is the evolution of the PCB photolithography process. LDI does not adopt photo tool, but directly exposes the patterns of Gerber file onto the photoresist film. This UV photoresist is selectively exposed to the UV laser beam in increments across the laminate in a raster manner. We are an innovative supplier of laser direct imaging (LDI) system solutions for various PCB manufacturing environments and adjacent markets. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications up to fully automated LDI system solutions for mass production environments. We are an innovative supplier of Laser Direct Imaging (LDI) system solutions for various PCB manufacturing environments and adjacent markets. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications up to fully automated LDI system solutions for mass production environments.

PCB Fabrication With Laser Direct Imaging

Laser Direct Infrared (LDIR) imaging provides a rapid and simplified path to molecular imaging using a quantum cascade laser (QCL) coupled with rapidly scanning optics. The Agilent 8700 LDIR chemical imaging system provides high-quality imaging and spectral data, and is ideally suited to the analysis of microplastics.. process. Continuing to derail the cost drivers associated with laser direct imaging will further enable LDI processing to play a leading role in PWB manufacturing today and into the future. Laser direct imaging for printed wiring board (PWB) applications emerged in the mid 1980's. The LDI systems offered at that time suffered from a variety of The use of laser direct imaging (LDI) processing for outer layer circuit pattern generation and the benefits already obtained with this process have encouraged attention to be focussed on the possibility of using laser direct imaging soldermask (LDISM) in the secondary imaging stage of printed circuit board (PCB) fabrication. The X3000 Laser Direct Imaging (LDI) system from Limata GmbH accurately images ultra-large, flexible, and endless PCB panels for dry-film patterning and solder mask imaging in PCB production. An integrated auto-calibration system provides accuracy, and high registration quality with linear and nonlinear transformations are automatically applied.

Explaining Laser Direct Imaging in PCB Fabrication by PCBGOGO

Agilent 8700 Laser Direct Infrared (LDIR) Chemical Imaging System Video. In this video demonstration see how the 8700 LDIR uses the latest Quantum Cascade Laser (QCL) technology coupled with rapidly scanning optics to provide fast, clear, high-quality images and spectral data. LDI, or Laser Direct Imaging, is a technology used in Printed Circuit Board manufacturing emerged as a response to the increasing complexity and miniaturization of electronic devices. As PCBs become more densely packed with finer features, traditional photolithography methods using photomasks have limitations in meeting these advanced requirements. KLA Announces Second Quarter Fiscal Year 2024 Earnings Date. November 15, 2023. KLA Announces Upcoming Investor Webcasts. November 2, 2023. KLA Declares Regular Cash Dividend. News. KLA is a leader in process control using advanced inspection tools, metrology systems, and computational analytics. Keep Looking Ahead. The X1000 Laser Direct Imaging (LDI) PCB System (Image source: Limata) What we are talking about here is a machine that's 1 m wide, 1.5 m deep, and weighs in at around 1,000 kg. You can purchase it with between 1 and 4 heads, each containing between 1 and 6 lasers, which (obviously) means you can have between 1 and 24 lasers depending on how.

PCB Laser Direct Imaging LDI Equipment 610x710mm

Designed for advanced high-density interconnect (HDI) including modified semi-additive processes (mSAP) and IC substrate mass production, this integrated system enables super-fine, highly uniform lines with outstanding accuracy, creating new opportunities for manufacturers and designers. Laser direct imaging (LDI) is a technique that uses high-intensity ultraviolet light to initiate a chemical reaction within a resist. As a result, the resist hardens. This imaging method can be applied to prototype circuit boards with wide trace widths.